尘土颗粒影响下电路板电化学迁移失效寿命建模探索
周怡琳, 杨璐, 鲁文睿
Exploring the Life Modeling Methods for Electrochemical Migration Failure of Printed Circuit Board under Dust Particles
ZHOU Yi-lin, YANG Lu, LU Wen-rui
北京邮电大学学报
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2020, (3): 11
-18,31
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DOI: 10.13190/j.jbupt.2019-170
