[1] Se rcu S, Ma rte ns L. Hig h-f requency circuit mo deling of lar ge pin co unt packag es [J]. IEEE Trans on M TT, 1997, 45( 10): 1897-1904. [2] Ye X, Dr ewnia k J L, Nadolny J, et al. Hig h-perfo rma nce inte r-PCB connector: analysis of EM I cha racteristics[J]. IEEE Trans on EM C, 2002, 44( 1): 165-174. [3] Se rcu S, Ma rens L. De termina tion of the o ptimal sig nal /g ro und co nfigura tion of amulti-pins co nnector for minimal cro sstalk [A]. Electrical Per fo rmance o f Elec tro nic Packaging , 1998, IEEE 7th to pical meeting [C]. 1998, 21-24. [4] Wei C, Ha rringto n R F, Mautz J R, e t al. Multiconducto r tra nsmissio n lines in multilay er dielec tricm edia [J]. IEEE Tra ns o n M TT, 1984, 32( 4): 439-449. [5] Clements J C, Paul C R, Adams A T. Computa tio n o f the capacita nce matrix for sy stems o f dielectricco ated cy lindrical co nductor s [J]. IEEE Tra ns o n EMC, 1975, 17( 4): 238-248. [6] Pan G W, Olso n K S, Gilber t B K. Impr ov ed a lg o rithmic methods fo r the pr edictio n of wav efr ont pr opagation behav io r in multico nduc tor tra nsmissio n line fo r high f requency digital signal pr ocessor s [J].IEEE Tra ns o n CAD, 1989, 8( 6): 608-621. [7] 李莉,万里兮,高攸纲. 不等长多导体传输线瞬态响应的FDTD模拟[J].北京邮电大学学报, 1999, 22( 1): 1-5.
Li L, Wa n L X, Gao Y G. Ca lcula tion of t ranscient respo nses o f unequal leng th multico nduc tor transmission line using FDTD metho d [J]. Jo urnal of Beijing Unive rsity of Po sts a nd Telecomm unications,1999, 22( 1): 1-5. |