Journal of Beijing University of Posts and Telecommunications

  • EI核心期刊
Exploring the Life Modeling Methods for Electrochemical Migration Failure of Printed Circuit Board under Dust Particles
ZHOU Yi-lin, YANG Lu, LU Wen-rui
Journal of Beijing University of Posts and Telecommunications . 2020, (3): 11 -18,31 .  DOI: 10.13190/j.jbupt.2019-170

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